DESCRIPTION
Cho-Form® 5528 and Cho-Form 5532 are one component, moisture cure, electrically conductive, form-in-place EMI gasketing materials. These formulations that contain silver-plated copper particles dispersed in a silicone elastomer, are specifically designed for highly conductive surfaces. These application specific materials also allow for ease of dispensing with increased flow rates over other form-in-place materials and softer beads for applications needing a high range of deflection. Both 5528 and 5532 are designed to be robotically dispensed onto a variety of substrates, ranging from metal castings to electrically conductive coatings on plastic substrates. The materials have identical electrical and mechanical properties and differ only in flow rate with 5528 having a slightly faster flow rate than 5532. These differences allow robotic dispensing on a variety of commercially available dispense equipment and to address specific material flow characteristics for specific part designs.
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